FORCED CONVECTIVE AIR COOLING FROM ELECTRONIC-COMPONENT ARRAYS IN A PARALLEL-PLATE CHANNEL

Citation
Yp. Gan et al., FORCED CONVECTIVE AIR COOLING FROM ELECTRONIC-COMPONENT ARRAYS IN A PARALLEL-PLATE CHANNEL, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 163-167
Citations number
7
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
ISSN journal
10709886
Volume
19
Issue
2
Year of publication
1996
Pages
163 - 167
Database
ISI
SICI code
1070-9886(1996)19:2<163:FCACFE>2.0.ZU;2-6
Abstract
This paper discusses air forced convection heat transfer from inline p rotruding elements arranged in eight rows. The streamwise and spanwise spacings between elements were varied using a splitter plate that can be positioned at three different modular configurations. A set of emp irical formulas was obtained to correlate the experimental data for ai r cooling systems design, Arrays of components with one odd-sized modu le have also been tested, Experimental results show that blocks near t he entrance and behind the odd-size module have improved performance c ompared to uniform arrangements, Accordingly, temperature sensitive co mponents are suggested to be placed in these locations.