Yp. Gan et al., FORCED CONVECTIVE AIR COOLING FROM ELECTRONIC-COMPONENT ARRAYS IN A PARALLEL-PLATE CHANNEL, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(2), 1996, pp. 163-167
This paper discusses air forced convection heat transfer from inline p
rotruding elements arranged in eight rows. The streamwise and spanwise
spacings between elements were varied using a splitter plate that can
be positioned at three different modular configurations. A set of emp
irical formulas was obtained to correlate the experimental data for ai
r cooling systems design, Arrays of components with one odd-sized modu
le have also been tested, Experimental results show that blocks near t
he entrance and behind the odd-size module have improved performance c
ompared to uniform arrangements, Accordingly, temperature sensitive co
mponents are suggested to be placed in these locations.