Pe. Bagnoli et al., ELECTROMIGRATION IN AL BASED STRIPES - LOW-FREQUENCY NOISE MEASUREMENTS AND MTF TESTS, Microelectronics and reliability, 36(7-8), 1996, pp. 1045-1050
Traditional [Median time to Failure (MTF)] and non traditional (Noise
measurements) techniques have been used to characterize four types of
Al based samples. Relatively weak stress conditions, which cause negli
gible modifications to the sample structure, have been used for noise
measurements, whereas more accelerated stress conditions have been use
d for lifetime tests. Quite different results have been obtained by th
e two types of characterization. In fact, the experimental data showed
that the noise measurements are useful to evaluate the activation ene
rgy at relatively weak stress conditions, but cannot be used to forese
e the behavior of the samples at strongly accelerated stress condition
s. This is particularly true in the case of samples containing copper
which probably undergo significant microstructural modifications as th
e temperature goes up. Moreover, the results of a simple computer simu
lation which show the dramatic effect on the Time to Failure of the sp
reading of the values of the thermal resistance of the samples are rep
orted. Copyright (C) 1996 Elsevier Science Ltd.