MOSFET TRANSISTORS FABRICATED WITH HIGH PERMITIVITY TIO2 DIELECTRICS

Citation
Sa. Campbell et al., MOSFET TRANSISTORS FABRICATED WITH HIGH PERMITIVITY TIO2 DIELECTRICS, I.E.E.E. transactions on electron devices, 44(1), 1997, pp. 104-109
Citations number
18
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
44
Issue
1
Year of publication
1997
Pages
104 - 109
Database
ISI
SICI code
0018-9383(1997)44:1<104:MTFWHP>2.0.ZU;2-Z
Abstract
Layers of polycrystalline anatase TiO2 have been deposited through the thermal decomposition of titanium tetrakis-isopropoxide (TTIP). 500 A ngstrom films deposited and annealed in oxygen at 750 degrees C had av erage roughnesses (R(a)) of about 30 Angstrom. Capacitors made form 19 0 Angstrom layers of TiO2 displayed a voltage dependent accumulation c apacitance. This was postulated to be caused by finite width effects i n the accumulation layer which we have dubbed the quantum capacitance effect. N-channel transistors made with these films showed near ideal behavior, but mobilities were significantly lower than those of therma l oxide MOSFET's. This mobility reduction was believed to be caused by interface states, which fell below 10(11) cm(-2) eV(-1) at midgap, bu t rose sharply on either side, unlike the ''U'' shaped behavior in the rmal oxide MOSFET's.