Rc. Keller et al., DRY-ETCHING OF HG1-XCDXTE USING CH4 H-2/AR/N-2 ELECTRON-CYCLOTRON-RESONANCE PLASMAS/, Journal of electronic materials, 25(8), 1996, pp. 1270-1275
An approach is presented which eliminates the problems caused by hydro
carbon polymer deposition during etching Hg1-xGdxTe with CH4/H-2 based
plasmas. We find that the addition of N-2 to the plasma inhibits poly
mer deposition in the chamber and an the sample. We speculate that ato
mic nitrogen formed from N, in the plasma has several beneficial effec
ts: the elimination of polymer precursors, the reduction of the atomic
hydrogen concentration, and a potential increase of methyl radical co
ncentration. Evidence for the reaction between the nitrogen and the po
lymer precursors is presented. It is also demonstrated that the additi
on of N-2 to CH4/H-2 based electron cyclotron resonance (ECR) plasmas
used to etch HgCdTe eliminates the roughness normally formed during et
ching and results in a steadier etch rate.