DRY-ETCHING OF HG1-XCDXTE USING CH4 H-2/AR/N-2 ELECTRON-CYCLOTRON-RESONANCE PLASMAS/

Citation
Rc. Keller et al., DRY-ETCHING OF HG1-XCDXTE USING CH4 H-2/AR/N-2 ELECTRON-CYCLOTRON-RESONANCE PLASMAS/, Journal of electronic materials, 25(8), 1996, pp. 1270-1275
Citations number
24
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
ISSN journal
03615235
Volume
25
Issue
8
Year of publication
1996
Pages
1270 - 1275
Database
ISI
SICI code
0361-5235(1996)25:8<1270:DOHUCH>2.0.ZU;2-F
Abstract
An approach is presented which eliminates the problems caused by hydro carbon polymer deposition during etching Hg1-xGdxTe with CH4/H-2 based plasmas. We find that the addition of N-2 to the plasma inhibits poly mer deposition in the chamber and an the sample. We speculate that ato mic nitrogen formed from N, in the plasma has several beneficial effec ts: the elimination of polymer precursors, the reduction of the atomic hydrogen concentration, and a potential increase of methyl radical co ncentration. Evidence for the reaction between the nitrogen and the po lymer precursors is presented. It is also demonstrated that the additi on of N-2 to CH4/H-2 based electron cyclotron resonance (ECR) plasmas used to etch HgCdTe eliminates the roughness normally formed during et ching and results in a steadier etch rate.