LINER CONFORMALITY IN IONIZED MAGNETRON SPUTTER METAL-DEPOSITION PROCESSES

Citation
S. Hamaguchi et Sm. Rossnagel, LINER CONFORMALITY IN IONIZED MAGNETRON SPUTTER METAL-DEPOSITION PROCESSES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 1996, pp. 2603-2608
Citations number
11
Categorie Soggetti
Physics, Applied
ISSN journal
10711023
Volume
14
Issue
4
Year of publication
1996
Pages
2603 - 2608
Database
ISI
SICI code
1071-1023(1996)14:4<2603:LCIIMS>2.0.ZU;2-2
Abstract
The conformality of thin metal films (liners) formed on high-aspect-ra tio trench structures in ionized magnetron sputter deposition processe s is studied numerically and experimentally. The numerical simulator ( SHADE) used to predict the surface topography is based on the shock-tr acking method for surface evolution. The simulation results are in goo d agreement with experimentally observed thin-film topography. It is s hown that combination of direct deposition and trench-bottom resputter ing results in good conformality of step coverages and the amount of t he resputtering needed for the good conformality is almost independent of trench aspect ratios. (C) 1996 American Vacuum Society.