S. Hamaguchi et Sm. Rossnagel, LINER CONFORMALITY IN IONIZED MAGNETRON SPUTTER METAL-DEPOSITION PROCESSES, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 1996, pp. 2603-2608
The conformality of thin metal films (liners) formed on high-aspect-ra
tio trench structures in ionized magnetron sputter deposition processe
s is studied numerically and experimentally. The numerical simulator (
SHADE) used to predict the surface topography is based on the shock-tr
acking method for surface evolution. The simulation results are in goo
d agreement with experimentally observed thin-film topography. It is s
hown that combination of direct deposition and trench-bottom resputter
ing results in good conformality of step coverages and the amount of t
he resputtering needed for the good conformality is almost independent
of trench aspect ratios. (C) 1996 American Vacuum Society.