Ny. Li et al., TENSILE STRAIN RELAXATION IN GANXP1-X (X-LESS-THAN-OR-EQUAL-TO-0.1) GROWN BY CHEMICAL BEAM EPITAXY, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(4), 1996, pp. 2952-2956
A study of strain relaxation in GaNxP1-x epilayers grown by chemical b
eam epitaxy, using a rf-plasma nitrogen radical beam source, tertiaryb
utylphosphine, and triethylgallium, is reported. Microcracks are obser
ved in GaNxP1-x epilayers grown on GaP when the nitrogen composition i
s greater than 1.6%. Transmission electron microscopy results show tha
t the tensile-strain relaxation in GaNxP1-x epilayers is initially rel
ieved by microcrack formation without misfit dislocations. These micro
cracks penetrate through the interface, degrading the crystallinity of
the GaP substrate. Microcracks formation can not be alleviated by adj
usting the growth rate, growth temperature, V/III ratios, and forward
plasma power, but they can be eliminated by reducing the growth area o
f the GaP substrate. (C) 1996 American Vacuum Society.