Crk. Marrian et al., MODELING OF ELECTRON ELASTIC AND INELASTIC-SCATTERING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 1996, pp. 3864-3869
The role of the form of the elastic and inelastic cross section in Mon
te Carlo simulations of electron-solid scattering has been studied to
understand the processes whereby energy is deposited by electrons as t
hey traverse thin films. Specifically we are interested in these pheno
mena as they relate to proximity effects in electron-beam lithography
and the detection of electrons by a Schottky diode with a patterned ab
sorber overlayer. Lithographic point and line spread functions have be
en measured in three resist materials. We show that the inclusion of d
iscrete inelastic scattering events whereby fast secondaries are gener
ated is essential for matching simulation and experiment. The secondar
ies are crucial in determining the shape of the spread functions in th
e 0.1-1 mu m regime and must be included to model proximity effects. F
urther, the fitting of line spread function simulations to experiment
allows the accurate prediction of dot spread functions and applied dos
e thresholds as well as three dimensional resist profiles. The form of
the elastic cross section is important in determining the energy loss
in, and transmission through, thin metallic films. For electron energ
ies where the film transmission is low, the Mott cross section provide
s a more accurate simulation than the screened Rutherford cross sectio
n.