APPLICATION OF A REACTION-DIFFUSION MODEL FOR NEGATIVE CHEMICALLY AMPLIFIED RESISTS TO DETERMINE ELECTRON-BEAM PROXIMITY CORRECTION PARAMETERS

Citation
N. Glezos et al., APPLICATION OF A REACTION-DIFFUSION MODEL FOR NEGATIVE CHEMICALLY AMPLIFIED RESISTS TO DETERMINE ELECTRON-BEAM PROXIMITY CORRECTION PARAMETERS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 1996, pp. 4252-4256
Citations number
16
Categorie Soggetti
Physics, Applied
ISSN journal
10711023
Volume
14
Issue
6
Year of publication
1996
Pages
4252 - 4256
Database
ISI
SICI code
1071-1023(1996)14:6<4252:AOARMF>2.0.ZU;2-C
Abstract
The method of single pixel exposures is applied for the determination of acid diffusion effects in negative chemically amplified resists. Th e wide range of crosslink density values contained in a single dot is used to determine nonlinear diffusion parameters. A reaction-diffusion model is developed where the diffusion coefficient D is a function of the crosslink density Theta. This function D(Theta) is evaluated for a given range of postexposure bake parameters in each case and the inf ormation obtained is used for proximity correction, also using the e-b eam lithography simulation tool LITHOS. In order to test the model und er different circumstances, two resists are studied, namely, the comme rcially available SAL-601 and the experimental epoxy novolac resist EP R. The diffusion coefficient is evaluated for each resist under the be st processing conditions. The proximity correction procedure is fully demonstrated in the case of SAL-601. (C) 1996 American Vacuum Society.