N. Glezos et al., APPLICATION OF A REACTION-DIFFUSION MODEL FOR NEGATIVE CHEMICALLY AMPLIFIED RESISTS TO DETERMINE ELECTRON-BEAM PROXIMITY CORRECTION PARAMETERS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 1996, pp. 4252-4256
The method of single pixel exposures is applied for the determination
of acid diffusion effects in negative chemically amplified resists. Th
e wide range of crosslink density values contained in a single dot is
used to determine nonlinear diffusion parameters. A reaction-diffusion
model is developed where the diffusion coefficient D is a function of
the crosslink density Theta. This function D(Theta) is evaluated for
a given range of postexposure bake parameters in each case and the inf
ormation obtained is used for proximity correction, also using the e-b
eam lithography simulation tool LITHOS. In order to test the model und
er different circumstances, two resists are studied, namely, the comme
rcially available SAL-601 and the experimental epoxy novolac resist EP
R. The diffusion coefficient is evaluated for each resist under the be
st processing conditions. The proximity correction procedure is fully
demonstrated in the case of SAL-601. (C) 1996 American Vacuum Society.