J. Thackeray et al., CORRELATION OF UVIIHS RESIST CHEMISTRY TO DISSOLUTION RATE MEASUREMENTS, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 1996, pp. 4267-4271
This article describes the correlation of UVIIHS resist chemistry to d
issolution rate measurements as a function of resist processing condit
ions. The acid generation efficiency, alpha, for the UVIIHS photoacid
generator is high, 0.027 cm(2)/mJ. The dissolution rate versus exposur
e curves show the excellent developer selectivity of UVIIHS, with n va
lues >8 for all processes. The r(max) values for this resist are above
20 000 Angstrom/s, which is higher than any positive resist previousl
y reported. The extent conversion for deprotection is directly related
to the dissolution rate changes; similar to 30% deprotection correlat
es to the E(0) dose for all process conditions evaluated. At 30%-40% a
cid produced, all of the deprotection chemistry is essentially complet
ed. The chemical contrast, as measured by extent conversion versus exp
osure dose, is strongly affected by the postexposure bake (PEB) temper
ature, with 140 degrees C FEB showing higher chemical and Lithographic
contrast than the 130 degrees C PEB. Mack's dissolution model has bee
n shown to work for these data sets. (C) 1996 American Vacuum Society.