N. Uchida et al., DYNAMIC MOTION OF MASK MEMBRANE IN X-RAY STEPPER, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(6), 1996, pp. 4350-4353
This article presents a new analysis method and experimental results f
or the deflection and vibration of x-ray masks, which are caused by th
e squeeze effect of the gas film between a mask and a wafer in x-ray s
teppers. The deflection and vibration occur when a mask-to-wafer gap s
etting is executed or if the wafer vibrates in the mask direction duri
ng stepping motion with a narrow gap. They are not only detrimental to
the throughput, but may also damage the mask membrane. Lees' differen
ce approximation method is applied to a compressible Reynolds' equatio
n and the equation of motion for the mask membrane. The main results o
f calculations and experiments, which showed good agreement with each
other, are outlined below. (1) When the wafer approaches the mash: at
a constant velocity, the mask deflection increases in proportion to th
e velocity, and the mask deflection is larger for a smaller mask tensi
le stress. (2) When the wafer vibrates in the mask direction, the ampl
itude of the mask vibration increases with increasing the wafer freque
ncy, and reaches a maximum value at a frequency that depends on the ga
p size. The maximum amplitude of a tested mask becomes 4 times as larg
e as the wafer amplitude. (3) For a high frequency and narrow gap, the
mask vibrates while deflecting convexly in the direction opposite to
that of the wafer. (C) 1996 American Vacuum Society.