A physical model of piezoresistance in thin polysilicon layers is deve
loped taking into account the contributions of intergranular potential
barriers and preferential grain orientation. The contribution of the
intergranular barrier depends strongly on the average grain size L. In
unrecrystallized, fine-grained poly-Si (L similar or equal to 120 nm)
, the effect of potential barrier is significant over the entire range
of concentrations and temperatures examined. In laser-recrystallized,
large-grained poly-Si (L similar or equal to 100 mu m) at high temper
atures and dopant concentrations, the contribution of the intergranula
r barrier is negligible.