W. Tsai et al., HIGH SELECTIVITY PLASMA-ETCHING OF SILICON DIOXIDE WITH A DUAL-FREQUENCY 27 2 MHZ CAPACITIVE RADIO-FREQUENCY DISCHARGE/, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 14(5), 1996, pp. 3276-3282
A 27 MHz/2 MHz Ar/CO/CFx rf capacitive discharge was used to selective
ly etch submicron SiO2/Si, SiO2/TiSi2 and SiO2/TiN structures. The bor
ophosphosilicate glass etch rate (similar to 1.0 mu m/min) was observe
d to decrease with bottom electrode temperature, whereas etch selectiv
ity to TiSi2 (>50:1) was found to increase with temperature, with a ph
otoresist selectivity >50:1. Plasma emission of the dual frequency dis
charge indicated the presence of an abundant concentration of the CF2
radical (249 nm) as compared to a lower frequency (400 kHz) rf dischar
ge with low etch selectivity (<20:1). Langmuir probe measurement indic
ated an enhancement of ion density of an order of magnitude (similar t
o 5x10(10) cm(-3)) as compared to the low frequency (400 kHz) rf disch
arge. Particle-in-cell simulation was used to calculate plasma density
as a function of excitation frequency. Plasma density scales with the
square of the source frequency while it remains relatively independen
t of the substrate frequency. (C) 1995 American Vacuum Society.