EXAMINATION OF REFLOW RESISTANCE FOR COPPER FRAME SMD PRODUCTS

The phenomenon of package which occur at soldering reflow of semicondu ctor surface mount device products was investigated. Copper frame prod ucts, compared with 42alloy frame products, is inferior in soldering r eflow-resistant. The shearing strength of frame materials and mold res in was obtained and relation with package crack was investigated with calculation and evaluation. A a result, adaptation of copper oxide fil m thickness was done, and by increasing the shearing strength of frame materials and resin, improvement of reflow-resistance became possible . Copyright (C) 1996 Elsevier Science Ltd