IN-SITU MONITORING OF DRY CORROSION DEGRADATION OF AU BALL BONDS TO AL BOND PADS IN PLASTIC PACKAGES DURING HTSL

Authors
RAGAY FW VONDERPOL JA NADERMAN J
Citation
Fw. Ragay et al., IN-SITU MONITORING OF DRY CORROSION DEGRADATION OF AU BALL BONDS TO AL BOND PADS IN PLASTIC PACKAGES DURING HTSL, Microelectronics and reliability, 36(11-12), 1996, pp. 1931-1934
Citations number
1
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Microelectronics and reliability → ACNP
ISSN journal
00262714
Volume
36
Issue
11-12
Year of publication
1996
Pages
1931 - 1934
Database
ISI
SICI code
0026-2714(1996)36:11-12<1931:IMODCD>2.0.ZU;2-H
Abstract
The ageing of Au ball bonds to Al bond pads during HTSL is studied by in-situ monitoring of the contact resistance. Unless the introduction of contact failures, the initial degradation of the ball bond resistan ce is independent of the moulding compound. Copyright (C) 1996 Elsevie r Science Ltd