MICRODAC - A NOVEL-APPROACH TO MEASURE IN-SITU DEFORMATION FIELDS OF MICROSCOPIC SCALE

Measurements of displacement fields on packaging components under mech anical and thermal load allow to analyse actual material behaviour. St rain distributions in components and assemblies, i.e. consequently loc ations of crucial strain and stress are determined. The microDAC metho d bases on algorithms of local object structure tracking in images obt ained from optical, laser scanning and electron scanning microscopy. M easured deformation fields can be utilised for design optimisation, pr oper material selection and processing, as well as for verification of finite element simulations. Copyright (C) 1996 Elsevier Science Ltd