3-DIMENSIONAL THERMAL MODELING BASED ON THE 2-PORT NETWORK THEORY FORHYBRID OR MONOLITHIC INTEGRATED POWER CIRCUITS

Authors
DORKEL JM TOUNSI P LETURCQ P
Citation
Jm. Dorkel et al., 3-DIMENSIONAL THERMAL MODELING BASED ON THE 2-PORT NETWORK THEORY FORHYBRID OR MONOLITHIC INTEGRATED POWER CIRCUITS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 501-507
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
19
Issue
4
Year of publication
1996
Pages
501 - 507
Database
ISI
SICI code
1070-9886(1996)19:4<501:3TMBOT>2.0.ZU;2-T
Abstract
This paper recalls how the two-port network theory can be extended to three-dimensional (3-D) conductive heat transfer in multilayered plane structures, Then it is shown how to build efficient computation tools by implementing this theory with help of fast Fourier transform (FFT) algorithms, These tools are particularly well-suited for the rapid th ermal analysis of power components or hybrid and integrated power circ uits. An illustration is given concerning thermal analysis of an insul ated gate bipolar power transistor (IGBT) power module and computed re sults are compared with experiment.