Jm. Dorkel et al., 3-DIMENSIONAL THERMAL MODELING BASED ON THE 2-PORT NETWORK THEORY FORHYBRID OR MONOLITHIC INTEGRATED POWER CIRCUITS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 501-507
This paper recalls how the two-port network theory can be extended to
three-dimensional (3-D) conductive heat transfer in multilayered plane
structures, Then it is shown how to build efficient computation tools
by implementing this theory with help of fast Fourier transform (FFT)
algorithms, These tools are particularly well-suited for the rapid th
ermal analysis of power components or hybrid and integrated power circ
uits. An illustration is given concerning thermal analysis of an insul
ated gate bipolar power transistor (IGBT) power module and computed re
sults are compared with experiment.