THERMALLY STABLE LOW OHMIC CONTACTS TO P-TYPE 6H-SIC USING COBALT SILICIDES

Citation
N. Lundberg et M. Ostling, THERMALLY STABLE LOW OHMIC CONTACTS TO P-TYPE 6H-SIC USING COBALT SILICIDES, Solid-state electronics, 39(11), 1996, pp. 1559-1565
Citations number
22
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
ISSN journal
00381101
Volume
39
Issue
11
Year of publication
1996
Pages
1559 - 1565
Database
ISI
SICI code
0038-1101(1996)39:11<1559:TSLOCT>2.0.ZU;2-O
Abstract
Cobalt silicide (CoSi2) ohmic contacts possessing low specific contact resistivity (rho(c) < 4.0 +/- 0.7 x 10(-6) Omega cm(2)) to p-type 6H- SiC are reported. The contacts were fabricated through sequential elec tron-beam evaporation of Co and Si layers forming a Si/Co/SiC structur e, followed by a two-step vacuum annealing process at 500 and 900 degr ees C, respectively. Specific contact resistivities were extracted fro m transmission line model (TLM) structures at temperatures ranging fro m 22 to 200 degrees C. rho(c) is investigated as a function of current density, temperature and ageing in a vacuum furnace at 1100 degrees C . Furthermore, comparison with a Co/SiC contact structure subjected to an identical annealing process revealed higher rho(c) and a modified sheet resistance requiring a different method of contact parameter ext raction. Copyright (C) 1996 Published by Elsevier Science Ltd