N. Lundberg et M. Ostling, THERMALLY STABLE LOW OHMIC CONTACTS TO P-TYPE 6H-SIC USING COBALT SILICIDES, Solid-state electronics, 39(11), 1996, pp. 1559-1565
Cobalt silicide (CoSi2) ohmic contacts possessing low specific contact
resistivity (rho(c) < 4.0 +/- 0.7 x 10(-6) Omega cm(2)) to p-type 6H-
SiC are reported. The contacts were fabricated through sequential elec
tron-beam evaporation of Co and Si layers forming a Si/Co/SiC structur
e, followed by a two-step vacuum annealing process at 500 and 900 degr
ees C, respectively. Specific contact resistivities were extracted fro
m transmission line model (TLM) structures at temperatures ranging fro
m 22 to 200 degrees C. rho(c) is investigated as a function of current
density, temperature and ageing in a vacuum furnace at 1100 degrees C
. Furthermore, comparison with a Co/SiC contact structure subjected to
an identical annealing process revealed higher rho(c) and a modified
sheet resistance requiring a different method of contact parameter ext
raction. Copyright (C) 1996 Published by Elsevier Science Ltd