EXPERIMENTAL CHARACTERIZATION OF TRANSMISSION-LINES IN THIN-FILM MULTICHIP MODULES

Authors
LIPA S STEER MB CANGELLARIS AC FRANZON PD
Citation
S. Lipa et al., EXPERIMENTAL CHARACTERIZATION OF TRANSMISSION-LINES IN THIN-FILM MULTICHIP MODULES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(1), 1996, pp. 122-126
Citations number
11
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
19
Issue
1
Year of publication
1996
Pages
122 - 126
Database
ISI
SICI code
1070-9886(1996)19:1<122:ECOTIT>2.0.ZU;2-J
Abstract
Signal propagation on transmission lines fabricated in thin polyimide films on silicon substrates is investigated. Series resistive and shun t conductive losses are separated and it is shown that the effective d ielectric loss is much higher than that expected from bulk material pr operties.