H. Fathollahnejad et al., LOW-RESISTANCE PD GE OHMIC CONTACTS TO EPITAXIALLY LIFTED-OFF N-TYPE GAAS FILM/, Journal of electronic materials, 24(1), 1995, pp. 35-38
A low resistance PdGe nonalloyed ohmic contact has been successfully f
ormed to epitaxially lifted-off n-type GaAs films. The contact is made
by lifting off partially metallized n-type GaAs films using the epita
xial lift-off method and bonding them to metallized Si substrates by n
atural intermolecular Van Der Waals forces. Low temperature sintering
(200 degrees C) of this contact results in metallurgical bonding and f
ormation of the ohmic contact. We have measured specific contact resis
tances of 5 x 10(-5) Ohm-cm(2) which is almost half the value obtained
for pure Pd contacts. Germanium forms a degenerately doped heterojunc
tion interfacial layer to GaAs. Our experimental results show that ger
manium diffuses to the interface and acts as a dopant layer to n-GaAs
film surface. Therefore, for epitaxially lifted-off n-type GaAs films,
PdGe is a low resistance ohmic metal contact to use.