LOW-RESISTANCE PD GE OHMIC CONTACTS TO EPITAXIALLY LIFTED-OFF N-TYPE GAAS FILM/

Citation
H. Fathollahnejad et al., LOW-RESISTANCE PD GE OHMIC CONTACTS TO EPITAXIALLY LIFTED-OFF N-TYPE GAAS FILM/, Journal of electronic materials, 24(1), 1995, pp. 35-38
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
ISSN journal
03615235
Volume
24
Issue
1
Year of publication
1995
Pages
35 - 38
Database
ISI
SICI code
0361-5235(1995)24:1<35:LPGOCT>2.0.ZU;2-O
Abstract
A low resistance PdGe nonalloyed ohmic contact has been successfully f ormed to epitaxially lifted-off n-type GaAs films. The contact is made by lifting off partially metallized n-type GaAs films using the epita xial lift-off method and bonding them to metallized Si substrates by n atural intermolecular Van Der Waals forces. Low temperature sintering (200 degrees C) of this contact results in metallurgical bonding and f ormation of the ohmic contact. We have measured specific contact resis tances of 5 x 10(-5) Ohm-cm(2) which is almost half the value obtained for pure Pd contacts. Germanium forms a degenerately doped heterojunc tion interfacial layer to GaAs. Our experimental results show that ger manium diffuses to the interface and acts as a dopant layer to n-GaAs film surface. Therefore, for epitaxially lifted-off n-type GaAs films, PdGe is a low resistance ohmic metal contact to use.