The effects of X-ray irradiation induced damage on long-term reliabili
ty of MOS structures have been investigated. The gate leakage currents
at low electric field during a measurement of Fowler-Nordheim tunneli
ng were increased after X-ray exposure, it was explained by the interf
ace trap-assisted tunneling mechanism. This leakage component was comp
letely eliminated by forming gas annealing at 450 degrees C. The long-
term reliability of MOS gate oxide is significantly affected by the re
sidual damages in the oxide even after forming gas annealing. In X-ray
damaged MOS structures, the average values of cumulative charge-to-br
eakdown (Q(bd)) were reduced about 15% as compared with the unexposed
devices. The major mechanism responsible for reduction of Q(bd) in irr
adiated devices is enhanced electron trapping into the neutral traps.