H. Sumida et al., THE MODIFIED STRUCTURE OF THE LATERAL IGBT ON THE SOI WAFER FOR IMPROVING THE DYNAMIC LATCH-UP CHARACTERISTICS, I.E.E.E. transactions on electron devices, 42(2), 1995, pp. 367-370
In this brief, the modified structure of the lateral IGBT(LIGBT) on th
e SOI wafer for improving the dynamic latchup characteristics is prese
nted with its numerical simulations and experimental results. The modi
fied LIGBT structure has a p(+)-emitter lever between the collector an
d gate regions. The current at which the latch-up occurs during the tu
rn-off transient under an inductive load is estimated in comparison wi
th that of the conventional LIGBT. The dynamic latch-up current at R.T
. and 125 degrees C for the modified LIGBT were 350 A/cm(2) and 290 A/
cm(2), respectively. These results indicate the improvement of about 3
.5 times at R.T. and about 5.5 times at 125 degrees C compared with th
ose for the conventional LIGBT. This remarkable improvement in the dyn
amic latch-up performance is accomplished at the expense of an increas
e of 0.8 V in the forward voltage drop.