A NEW METHOD TO OBTAIN CU FILMS WITH LOWER RESISTIVITY AND HIGHER INTERFACE ADHESION ON DIFFERENT SUBSTRATES

Authors
YANG J WANG C TAO K FAN YD
Citation
J. Yang et al., A NEW METHOD TO OBTAIN CU FILMS WITH LOWER RESISTIVITY AND HIGHER INTERFACE ADHESION ON DIFFERENT SUBSTRATES, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(2), 1995, pp. 481-484
Citations number
18
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Journal title
Journal of vacuum science & technology. A. Vacuum, surfaces, and films → ACNP
ISSN journal
07342101
Volume
13
Issue
2
Year of publication
1995
Pages
481 - 484
Database
ISI
SICI code
0734-2101(1995)13:2<481:ANMTOC>2.0.ZU;2-H