FINE LINE CIRCUIT MANUFACTURING TECHNOLOGY WITH ELECTROLESS COPPER PLATING

Authors
AKAHOSHI H KAWAMOTO M ITABASHI T MIURA O TAKAHASHI A KOBAYASHI S MIYAZAKI M MUTOH T WAJIMA M ISHIMARU T
Citation
H. Akahoshi et al., FINE LINE CIRCUIT MANUFACTURING TECHNOLOGY WITH ELECTROLESS COPPER PLATING, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 127-135
Citations number
21
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
18
Issue
1
Year of publication
1995
Pages
127 - 135
Database
ISI
SICI code
1070-9886(1995)18:1<127:FLCMTW>2.0.ZU;2-3
Abstract
Two types of additive processes for fine circuit pattern manufacturing technology using electroless copper plating have been developed, The processes offer high dimensional accuracy, Technical aspects of the ad ditive processes, materials for the fabrication of additive circuits, and the performance of these circuits are reported here.