B. Elkareh et al., SILICON-ON-INSULATOR - AN EMERGING HIGH-LEVERAGE TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 187-194
Silicon on insulator (SOI) has emerged as a high-leverage technology f
or a wide range of commercial and military applications, While the use
of SOI is presently limited to special niche applications, such as ra
diation-hard space and defense electronics, thin-film SOI has become s
trategic for low-power, battery-operated portable systems and large-sc
ale integrated logic and memory circuits with sub-hair micron features
, Substantial process simplification and cost reduction result from th
e dielectrically isolated structures, Other important SOI applications
are the merger of several functions on the same die that performs rel
iably in adverse high-temperature environments, These include analog a
nd logic functions, smart micromechanical sensors for automotive and d
istributed jet engine control with logic functions, or smart high-volt
age CMOS logic/control elements, Manufacturable solutions to several m
aterial and device problems, however, must be demonstrated before SOI
CMOS or BiCMOS designs enter the high volume commercial manufacturing
stage, Among these are the availability, cost, and quality of SOI mate
rial, gettering, electrostatic discharge protection, the floating-body
problem in thin-film structures, and self-heating effects caused by t
he low thermal conductivity of the buried-oxide layer. The status of S
OI material is discussed, including the different methods used to prep
are large SOI wafers, wafer availability, cost reduction strategies, m
aterial characterization, and material quality, Applications and lever
age areas are also described, with emphasis on problems and challenges
that lie ahead for the large-scale manufacture of SOI products, The p
otential economic impact of SOI technology on the profitability of sem
iconductor manufacturing is described.