For advanced surface micromachining 3D UV-Microforming delivers excell
ent results. This low-cost technology, a combination of UV patterning
of very thick photoresist layers and and moulding of the resulting pat
terns by galvanoplating, opens a wide range of applications. If combin
ed with sacrificial layer technology, this new technique offers a wide
variety of smart processing methods. Especially the generation of sac
rificial layers by electrodeposition itself enables the construction o
f micro components with high precision from the mum to the mm range. 3
D UV-Microforming allows the use of materials with interesting propert
ies which could not be provided by standard processes. Furthermore, th
is method can be carried out directly on pre-processed chips. The prac
tical application of the technology is demonstrated on micro channels,
micro coils and micro switches.