We have achieved successful monolithic integration of high electron mo
bility transistors and heterojunction bipolar transistors in the same
microwave circuit. We have used selective molecular beam epitaxy and a
novel merged processing technology to fabricate monolithic microwave
integrated circuits that incorporate both 0.2 mu m gate-length pseudom
orphic InGaAs-GaAs HEMTs and 2 mu m emitter-width GaAs-AlGaAs HBTs. Th
e HEMT and HBT devices produced by selective MBE and fabricated using
our merged HEMT-HBT process exhibited performance equivalent to device
s fabricated using normal MBE and our baseline single-technology proce
sses. The selective MBE process yielded 0.2 mu m HEMT devices with g(m
) = 600 mS/mm and f(T) = 70 GHz, while 2 x 10 mu m(2) HBT devices achi
eved beta, 50 and f(T) = 21.4 GHz at J(C) = 2 x 10(4) A/cm(2). The per
formance of both a 5-10 GHz HEMT LNA with active on-chip HBT regulatio
n and a 20 GHz Darlington HBT amplifier are shown to be equivalent whe
ther fabricated using normal or selective MBE.