We have used X-ray diffraction to study the residual elastic strain in
InxGa1 - xAs (0.07 < x < 0.14) layers grown by MOVPE on GaAs substrat
e, as a function of growth conditions, growth procedures and post-grow
th treatment. The samples have been grown at temperatures ranging from
625 degrees C to 680 degrees C with a growth rate between 0.45 and 2
mu m/h. For thick layers, the residual elastic strain represents about
15% of the initial lattice mismatch and is independent of the Indium
composition. The extent of strain relief is not significantly changed
by an increase in growth temperature from 625 degrees C to 680 degrees
C. On the other hand, we found that the extent of strain relief is de
pendant upon the growth rate. The residual strain can be reduced to 5%
of the lattice mismatch by lowering the growth rate from 1 to 0.45 mu
m/h. This variation is related to the increased time at which the str
ucture is at the growth temperature, since a post-growth annealing for
one hour at growth temperature of a sample grown at 1 mu m/h leads al
so to the same reduction of the residual strain. Due to dislocations i
nteractions, the effective stress responsible for dislocations motion
and consequently the dislocation gliding velocity are significantly re
duced. In these conditions, the time required by a dislocation to glid
e to the interface is comparable to the growth time.