BIAS AND TEMPERATURE-DEPENDENCE OF HOMOGENEOUS HOT-ELECTRON INJECTIONFROM SILICON INTO SILICON DIOXIDE AT LOW VOLTAGES

Citation
B. Fischer et al., BIAS AND TEMPERATURE-DEPENDENCE OF HOMOGENEOUS HOT-ELECTRON INJECTIONFROM SILICON INTO SILICON DIOXIDE AT LOW VOLTAGES, I.E.E.E. transactions on electron devices, 44(2), 1997, pp. 288-296
Citations number
34
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
44
Issue
2
Year of publication
1997
Pages
288 - 296
Database
ISI
SICI code
0018-9383(1997)44:2<288:BATOHH>2.0.ZU;2-X
Abstract
In this paper, new homogeneous hot-electron injection data at 300 K an d 77 R is provided covering applied voltages from well below to well. above the Si-SiO2 barrier height, and a Hide range of oxide fields, We found that, in contrast to the MOSFET case, homogeneous injection sho ws two different regimes for accelerating voltages below and above the barrier height. A simple interpretation of the data is proposed, and supported by Monte Carlo (MC) simulations of the injection experiment. Essentially, the two regimes are the signature of a marked transition between an electron population mostly heated by the electric field, a nd a tail population created by additional but less efficient energy g ain mechanisms, leading to a sharp transition in the carrier distribut ion function, The details of the bias and temperature dependence of in jection are then interpreted as the combined effect of tunneling and c arrier distribution, Furthermore, possible implications on MOSFET gate currents are briefly discussed.