PERFORMANCE AND RELIABILITY IMPROVEMENTS IN POLY-SI TFTS BY FLUORINE IMPLANTATION INTO GATE POLY-SI

Citation
S. Maegawa et al., PERFORMANCE AND RELIABILITY IMPROVEMENTS IN POLY-SI TFTS BY FLUORINE IMPLANTATION INTO GATE POLY-SI, I.E.E.E. transactions on electron devices, 42(6), 1995, pp. 1106-1112
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
42
Issue
6
Year of publication
1995
Pages
1106 - 1112
Database
ISI
SICI code
0018-9383(1995)42:6<1106:PARIIP>2.0.ZU;2-2
Abstract
High-performance and high-reliability TFT's have been obtained using a fluorine ion implantation technique, The fluorine implantation into t he gate poly-Si of TFT caused a positive Vth shift, increased the ON c urrent, and decreased the leakage current significantly, Our investiga tion indicates that the Vth shift originates from negative charges gen erated in the gate oxide by the fluorine implantation, The improvement of drain current is attributed to fluorine passivation of trap states in the poly-Si and to a modulation of offset potential due to the sam e negative charges under the offset region, Furthermore, high immunity against the -BT stress and TDDB of the gate oxide was achieved by the fluorine implantation, It is considered that the strong Si-F bonds cr eated by the fluorine implantation raise the stress immunity.