ELECTRONIC COMPONENTS AND MATERIALS - FOREWORD

Authors
WONG CP LIN A ZHOU ZG
Citation
Cp. Wong et al., ELECTRONIC COMPONENTS AND MATERIALS - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(2), 1995, pp. 243-244
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
18
Issue
2
Year of publication
1995
Pages
243 - 244
Database
ISI
SICI code
1070-9886(1995)18:2<243:ECAM-F>2.0.ZU;2-#