This paper reviews recent developments in N2O- and NO-based oxynitride
gate dielectrics for CMOS ULSI applications. These dielectrics are ex
tremely attractive due to their process simplicity, thickness controll
ability, and excellent electrical characteristics. In this paper, seve
ral issues like thickness scaling, growth kinetics, chemical compositi
on, electrical properties, hot-carrier reliability, and EEPROM applica
tions of these dielectrics are discussed.