M. Nafria et al., RELATION BETWEEN DEGRADATION AND BREAKDOWN OF THIN SIO2-FILMS UNDER AC STRESS CONDITIONS, Microelectronic engineering, 28(1-4), 1995, pp. 321-324
MOS capacitors have been subjected to bipolar voltage waveforms of dif
ferent amplitudes and frequencies. The current density measured under
a DC low-value gate voltage is taken as an indicator of the oxide degr
adation level, so that its evolution is taken as a measure of the prog
ressive wearout of the oxide. The data suggest lower degradation level
s, for the same stress times, at high frequencies. This is consistent
with the increase of the time-to-breakdown with frequency and confirms
that, also for dynamic stresses, the relation between degradation and
breakdown is fundamental to understand the physics of dielectric brea
kdown.