ELECTRON BEAM-ASSISTED GROWTH OF ULTRATHIN SILICON OXYNITRIDE FILMS ON SI(100) AT MODERATE TEMPERATURES - IN-SITU DETERMINATION OF COMPOSITION AND GAP WIDTH
P. Poveda et A. Glachant, ELECTRON BEAM-ASSISTED GROWTH OF ULTRATHIN SILICON OXYNITRIDE FILMS ON SI(100) AT MODERATE TEMPERATURES - IN-SITU DETERMINATION OF COMPOSITION AND GAP WIDTH, Microelectronic engineering, 28(1-4), 1995, pp. 357-360
Exposure of a Si(100)-2x1 surface to low pure NO gas pressures (less t
han or equal to 8x10(-6) mbar) at moderate temperatures (room temperat
ure (RT) - 600 degrees C) leads to the formation of an amorphous passi
vating oxynitride layer (thickness similar to 0.5 nm). However, we sho
w that low energy (100 eV) electron bombardment of the surface, during
exposure to NO, induces the formation of amorphous ultrathin (less th
an or equal to 2 nm) silicon oxynitride films having different element
al compositions. At RT, oxygen-rich films were grown, while nitrogen-r
ich layers were formed at 600 degrees C. The thickness and the composi
tion or the gap of the resulting insulating layers have been in situ d
educed from Auger Electron Spectroscopy (AES) or Reflection Electron E
nergy Loss Spectroscopy (REELS) measurements respectively, using a sta
ndard single-pass Cylindrical Mirror Analyzer (CMA).