OPTIMIZATION OF SILICA DEPOSITION BY SPUTTERING IN THE SILICON THIN-FILM TRANSISTORS REALIZATION IN LOW-TEMPERATURE TECHNOLOGY

Citation
Kk. Sion et al., OPTIMIZATION OF SILICA DEPOSITION BY SPUTTERING IN THE SILICON THIN-FILM TRANSISTORS REALIZATION IN LOW-TEMPERATURE TECHNOLOGY, Microelectronic engineering, 28(1-4), 1995, pp. 459-462
Citations number
NO
Categorie Soggetti
Optics,"Physics, Applied","Engineering, Eletrical & Electronic
Journal title
ISSN journal
01679317
Volume
28
Issue
1-4
Year of publication
1995
Pages
459 - 462
Database
ISI
SICI code
0167-9317(1995)28:1-4<459:OOSDBS>2.0.ZU;2-B
Abstract
This paper gives some optical and electrical characteristics of silico n dioxide thin films obtained by magnetron sputtering. The aim of thes e films is to serve as gate insulator of MOS transistors with poly-Si active semiconductor. As-deposited thin films with properties close to the ones obtained by other methods, including thermal oxidation, howe ver, present, in some cases, important leakage currents, which can be reduced by annealing.