C. Tsamis et al., DECREASE OF THE LATERAL DISTRIBUTION OF INTERSTITIALS IN SILICON-ON-INSULATOR STRUCTURES, Microelectronic engineering, 28(1-4), 1995, pp. 463-466
In this work we present a series of experimental results performed in
Silicon-On-Insulator material, where Oxidation Stacking Faults are use
d to monitor the silicon interstitial distribution after an oxidation
process. These results demonstrate that the lateral distribution of th
ese point defects show an important decrease as compared with bulk sil
icon. This decrease mostly depends on the thickness of the Si overlaye
r. Comparison with simulation reveals fundamental properties of Si int
erstitials.