SUBSTRATE BIAS EFFECTS IN HIGH-ASPECT-RATIO SIO2 CONTACT ETCHING USING AN INDUCTIVELY-COUPLED PLASMA REACTOR

Authors
WESTERHEIM AC LABUN AH DUBASH JH ARNOLD JC SAWIN HH YUWANG V
Citation
Ac. Westerheim et al., SUBSTRATE BIAS EFFECTS IN HIGH-ASPECT-RATIO SIO2 CONTACT ETCHING USING AN INDUCTIVELY-COUPLED PLASMA REACTOR, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(3), 1995, pp. 853-858
Citations number
13
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films
Journal title
Journal of vacuum science & technology. A. Vacuum, surfaces, and films → ACNP
ISSN journal
07342101
Volume
13
Issue
3
Year of publication
1995
Part
1
Pages
853 - 858
Database
ISI
SICI code
0734-2101(1995)13:3<853:SBEIHS>2.0.ZU;2-0