Ac. Westerheim et al., SUBSTRATE BIAS EFFECTS IN HIGH-ASPECT-RATIO SIO2 CONTACT ETCHING USING AN INDUCTIVELY-COUPLED PLASMA REACTOR, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 13(3), 1995, pp. 853-858
Citations number
13
Categorie Soggetti
Physics, Applied","Materials Science, Coatings & Films