A HIGHLY ROBUST PROCESS INTEGRATION WITH SCALED ONO INTERPOLY DIELECTRICS FOR EMBEDDED NONVOLATILE MEMORY APPLICATIONS

Citation
Dp. Shum et al., A HIGHLY ROBUST PROCESS INTEGRATION WITH SCALED ONO INTERPOLY DIELECTRICS FOR EMBEDDED NONVOLATILE MEMORY APPLICATIONS, I.E.E.E. transactions on electron devices, 42(7), 1995, pp. 1376-1377
Citations number
7
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
42
Issue
7
Year of publication
1995
Pages
1376 - 1377
Database
ISI
SICI code
0018-9383(1995)42:7<1376:AHRPIW>2.0.ZU;2-2
Abstract
We have developed a process sequence for a Bash EEPROM memory embedded in an advanced microcontroller circuit. This process simultaneously f orms a thick top oxide on the interpoly ONO dielectric in the memory a rray and a stacked gate-oxide for the logic transistors. We have fabri cated one-transistor, hash bit-cells with good data retention characte ristics that incorporate a 17 nn ONO film along with high-quality stac ked gate oxides.