Dp. Shum et al., A HIGHLY ROBUST PROCESS INTEGRATION WITH SCALED ONO INTERPOLY DIELECTRICS FOR EMBEDDED NONVOLATILE MEMORY APPLICATIONS, I.E.E.E. transactions on electron devices, 42(7), 1995, pp. 1376-1377
We have developed a process sequence for a Bash EEPROM memory embedded
in an advanced microcontroller circuit. This process simultaneously f
orms a thick top oxide on the interpoly ONO dielectric in the memory a
rray and a stacked gate-oxide for the logic transistors. We have fabri
cated one-transistor, hash bit-cells with good data retention characte
ristics that incorporate a 17 nn ONO film along with high-quality stac
ked gate oxides.