LT-GAAS WITH HIGH BREAKDOWN STRENGTH AT LOW-TEMPERATURE FOR POWER MISFET APPLICATIONS

Citation
Km. Lipka et al., LT-GAAS WITH HIGH BREAKDOWN STRENGTH AT LOW-TEMPERATURE FOR POWER MISFET APPLICATIONS, Journal of electronic materials, 24(7), 1995, pp. 913-916
Citations number
20
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
ISSN journal
03615235
Volume
24
Issue
7
Year of publication
1995
Pages
913 - 916
Database
ISI
SICI code
0361-5235(1995)24:7<913:LWHBSA>2.0.ZU;2-3
Abstract
Low temperature grown GaAs has been fabricated containing a limited am ount of excess arsenic. The material has a low conductivity in the ord er of 100K Ohm cm, due to hopping in a deep donor band. This sigma-LT- GaAs was grown reproducibly by using the lattice mismatch as the prima ry parameter for substrate temperature calibration. Breakdown fields, in the order of 100kV/cm, are observed for planar structures and incre ased at low measurement emperatures. Low hopping conductivity and high breakdown field are also observed in the lossy dielectric metal-insul ator-semiconductor field-effect transistor device using sigma-LT-GaAs as a surface layer. The record radio frequency power density of 4.0W/m m at 77K is extracted from the de output characteristics.