Wg. Lee et Si. Woo, PREPARATION AND CHARACTERIZATION OF PZT FERROELECTRIC THIN-FILMS BY PLASMA-ENHANCED METALORGANIC CHEMICAL-VAPOR-DEPOSITION, Integrated ferroelectrics, 9(1-3), 1995, pp. 21-29
PZT thin films with a uniform distribution of components were prepared
by plasma enhanced chemical vapor deposition (PECVD) using Pb(C2H5)(4
), Z (O-i-C4H9)(4), Ti(O-i-C3H7)(4), and oxygen. The crystallization o
f films was (sic) after annealing in the temperature range between 450
and 550 degrees C under O-2 ambient for 1 hr. The significant change
of Pb concentration in PECVD PZT thin films was not observed in the re
lation to annealing temperature and time. The dielectric constant PECV
D PZT thin films increased with the Ti content, showed the maximum val
ue in the vicinity of morphotropic phase boundary (MPB) composition of
PZT material, and decreased with the Ti content. The leakage current
density of PZT (65/35) thin film of 180 nm in thickness was 3.37 X 10(
-7) A/cm(2) at the applied voltage of 3 V. Remanent polarization incre
ased with increasing of Zr content in the film and coercive field was
nearly independent of the composition. The typical values of electrica
l properties were epsilon(r) = 570, E(c) = 90 kV/cm, and P-r= 19 mu C/
cm(2) in the PECVD PZT (54/46) thin film of 220 nm in thickness.