A MOSSBAUER STUDY OF TIN-BASED INTERMETALLICS FORMED DURING THE MANUFACTURE OF DISPERSION-STRENGTHENED COMPOSITE SOLDERS

Authors
RENO RC PANUNTO MJ PIEKARSKI BH
Citation
Rc. Reno et al., A MOSSBAUER STUDY OF TIN-BASED INTERMETALLICS FORMED DURING THE MANUFACTURE OF DISPERSION-STRENGTHENED COMPOSITE SOLDERS, Journal of electronic materials, 26(1), 1997, pp. 11-15
Citations number
12
Categorie Soggetti
Engineering, Eletrical & Electronic","Material Science
Journal title
Journal of electronic materials → ACNP
ISSN journal
03615235
Volume
26
Issue
1
Year of publication
1997
Pages
11 - 15
Database
ISI
SICI code
0361-5235(1997)26:1<11:AMSOTI>2.0.ZU;2-D
Abstract
Mossbauer spectroscopy was used to characterize dispersion-strengthene d composite solder powders that were formed through hot gas spray atom ization. To perform quantitative measurements, we first measured the r elative recoilless fractions of eutectic solder and three intermetalli c compounds: Cu3Sn, Cu6Sn5, and Ni3Sn4. These results were then used t o determine the concentrations of intermetallic species present in var ious composite solder samples. Mossbauer spectroscopy was shown to be an effective:tool in the analysis of dispersion-strengthened composite solders and was preferentially sensitive to the presence of tin-based intermetallics and oxides.