QUICK INSPECTION OF POWER-PLANE SHORT FAULT ON MULTILAYER SUBSTRATE

Authors
CHAO FL WU RB
Citation
Fl. Chao et Rb. Wu, QUICK INSPECTION OF POWER-PLANE SHORT FAULT ON MULTILAYER SUBSTRATE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 466-470
Citations number
5
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Material Science
Journal title
IEEE transactions on components, packaging, and manufacturing technology. Part A → ACNP
ISSN journal
10709886
Volume
18
Issue
3
Year of publication
1995
Pages
466 - 470
Database
ISI
SICI code
1070-9886(1995)18:3<466:QIOPSF>2.0.ZU;2-G
Abstract
A quick inspection approach for finding the power-plane short fault on multichip modules is proposed in this paper, The current source is ap plied on two diagonal corners of the power plane, The location of the short fault can be determined by as few as four voltage measurements. Also, the sheet conductivity of the power plane can be obtained as a b y-product, Experiments have been performed and the successful predicti on of the exact short point validates the present inspection approach.