Fl. Chao et Rb. Wu, QUICK INSPECTION OF POWER-PLANE SHORT FAULT ON MULTILAYER SUBSTRATE, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 466-470
A quick inspection approach for finding the power-plane short fault on
multichip modules is proposed in this paper, The current source is ap
plied on two diagonal corners of the power plane, The location of the
short fault can be determined by as few as four voltage measurements.
Also, the sheet conductivity of the power plane can be obtained as a b
y-product, Experiments have been performed and the successful predicti
on of the exact short point validates the present inspection approach.