Gm. Chrysler et al., JET IMPINGEMENT BOILING OF A DIELECTRIC COOLANT IN NARROW GAPS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 527-533
An experimental investigation into the effect of the chip-to-orifice g
ap was conducted for jet-impingement boiling of FC-72 at the back surf
ace of a 6.5-mm square thermal chip on a 28-mm square ceramic substrat
e, Four different types of jets were used, all of them employing a sin
gle 0.50-mm diameter orifice, A fixed-position jet impingement pin wit
h the orifice centered on a flat face measuring 7.62 mm on an edge was
used as a base case, This jet supported a heat flux of about 120 W/cm
(2) at a reasonable flowrate. Variable-position jet impingement piston
s were shown to perform as well as, but no better than the base case,
Additional tests were conducted to investigate performance with variat
ion in the chip-to-orifice gap, Thermal performance was found to be in
sensitive to the gap at large spacing, but below some specific gap it
degraded with decreasing gap, A sudden jump in the chip temperature wa
s discovered to occur at a specific gap, This gap length was found to
vary with jet flowrate.