S. Liu et al., INVESTIGATION OF CRACK-PROPAGATION IN CERAMIC CONDUCTIVE EPOXY GLASS SYSTEMS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 627-633
The primary objective of this combined experimental and analytical stu
dy was to investigate the mechanical behavior of glass/conductive adhe
sive/Al2O3 systems with a surface notch, measure the properties of the
system at various temperatures, implement these temperature dependent
properties into a nonlinear finite element framework, and predict the
initiation and growth of cracking, The three major tasks of this work
include: (a) testing of fracture strength of the systems at three dif
ferent temperatures, including the determination of thermal crack init
iation and growth, (b) determination of basic thermal-mechanical prope
rties of adhesive, glass, and Al2O3, respectively, and (c) identificat
ion of appropriate quantities to predict damage modes, including initi
ation and growth, at different temperatures and comparing the data wit
h experiments, The major conclusions are as follows: (a) realistic non
linear material properties are essential input for correct nonlinear f
inite element modeling, (b) J-integral can be applied to predict the c
rack initiation and growth for the material system considered, (c) eit
her bulk glass material or the adhesive/glass interface may fail depen
ding on the applied temperature and notch length, and (d) curved crack
growth path inside the glass can be predicted by fracture mechanics.