H. Puchner et S. Selberherr, AN ADVANCED MODEL FOR DOPANT DIFFUSION IN POLYSILICON, I.E.E.E. transactions on electron devices, 42(10), 1995, pp. 1750-1755
A two-dimensional simulation model for dopant diffusion in polysilicon
has been developed, which includes dopant clustering in grain interio
rs as well as in grain boundaries. The grain growth model is coupled w
ith the diffusion coefficient of the dopants and the process temperatu
re based on thermodynamic concepts, For high dose implantation cases t
he trapping/emission mechanism between grain interiors and grain bound
aries and the grain growth are the major effects during thermal treatm
ent processes, The polysilicon grains itself are assumed to be tiny sq
uares, growing from initial size. In order to handle nonplanar semicon
ductor structures, we use a transformation method for the simulation a
rea as well as for the PDE's.