AN ADVANCED MODEL FOR DOPANT DIFFUSION IN POLYSILICON

Citation
H. Puchner et S. Selberherr, AN ADVANCED MODEL FOR DOPANT DIFFUSION IN POLYSILICON, I.E.E.E. transactions on electron devices, 42(10), 1995, pp. 1750-1755
Citations number
20
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189383
Volume
42
Issue
10
Year of publication
1995
Pages
1750 - 1755
Database
ISI
SICI code
0018-9383(1995)42:10<1750:AAMFDD>2.0.ZU;2-Q
Abstract
A two-dimensional simulation model for dopant diffusion in polysilicon has been developed, which includes dopant clustering in grain interio rs as well as in grain boundaries. The grain growth model is coupled w ith the diffusion coefficient of the dopants and the process temperatu re based on thermodynamic concepts, For high dose implantation cases t he trapping/emission mechanism between grain interiors and grain bound aries and the grain growth are the major effects during thermal treatm ent processes, The polysilicon grains itself are assumed to be tiny sq uares, growing from initial size. In order to handle nonplanar semicon ductor structures, we use a transformation method for the simulation a rea as well as for the PDE's.