S. Daliento et al., 2-DIMENSIONAL ANALYSIS OF A TEST STRUCTURE FOR LIFETIME PROFILE MEASUREMENTS, I.E.E.E. transactions on electron devices, 42(11), 1995, pp. 1924-1928
A new electrical measurement technique has been proposed [1] that allo
ws to obtain the ''local'' lifetime value in Si layers, by superposing
ac measurements on a de bias in a three-terminal test structure, and
hence to extract a lifetime ''profile'' along the depth of the layer b
y varying the voltage bias. In this paper two-dimensional effects that
could arise due to the lateral current how in the test structure are
studied, and are related to the modifications of the lifetime profile
extracted, Both a simplified analysis and 2-D simulations of the test
structure behavior allow to explain the 2-D effects responsible for de
viation of the lifetime profile from the correct one as dependent on t
he geometry of the test structure, Moreover design rules are given for
the test structure, that keep the error in the profile extracted with
in safe limits.