Merging of two epitaxial lateral overgrowth fronts has been achieved t
o produce thin silicon-on-insulator (SOI) structures. The electronic q
uality of the material is generally of high quality; however, at the m
erger interface are defects associated with improper merging. Defects
at the oxide/silicon interface and the merging interface were characte
rized using transmission electron microscopy. Device performance indic
ated the need for a process modification to improve the material quali
ty for potential electronic applications.