STATISTICS OF SOLDER JOINT ALIGNMENT FOR OPTOELECTRONIC COMPONENTS

Authors
MCGROARTY J BORGESEN P YOST B LI CY
Citation
J. Mcgroarty et al., STATISTICS OF SOLDER JOINT ALIGNMENT FOR OPTOELECTRONIC COMPONENTS, IEEE transactions on components, hybrids, and manufacturing technology, 16(5), 1993, pp. 527-529
Citations number
5
Categorie Soggetti
Material Science","Engineering, Eletrical & Electronic
Journal title
IEEE transactions on components, hybrids, and manufacturing technology → ACNP
ISSN journal
01486411
Volume
16
Issue
5
Year of publication
1993
Pages
527 - 529
Database
ISI
SICI code
0148-6411(1993)16:5<527:SOSJAF>2.0.ZU;2-N
Abstract
The use of an area array of solder joints allows the self-alignment of a large number of components in microelectronic packages. The sensiti vity to statistical variations in solder joint volumes is investigated . The analysis shows that sufficiently large arrays of randomly distri buted volumes lead to very narrow distributions in the height and tilt of one component relative to another.