A METHOD OF ADHESION STRENGTH TEST FOR THICK-FILM

Authors
YATA K ENOKIDO Y YAMAGUCHI T
Citation
K. Yata et al., A METHOD OF ADHESION STRENGTH TEST FOR THICK-FILM, IEEE transactions on components, hybrids, and manufacturing technology, 16(6), 1993, pp. 584-591
Citations number
15
Categorie Soggetti
Material Science","Engineering, Eletrical & Electronic
Journal title
IEEE transactions on components, hybrids, and manufacturing technology → ACNP
ISSN journal
01486411
Volume
16
Issue
6
Year of publication
1993
Pages
584 - 591
Database
ISI
SICI code
0148-6411(1993)16:6<584:AMOAST>2.0.ZU;2-2
Abstract
A method of adhesion strength test for thick films has been developed. Adhesion strength of silver-glass thick-film/alumina substrate was ob tained without soldering. Three types of adhesion strengths were intro duced: prefracture adhesion strength; fracture process adhesion streng th; and total adhesion strength, which is the sum of the other two adh esion strengths. The relation between adhesion strengths and microstru cture was discussed. Strength of glass, thickness of glass layer, and densification of silver powder were proposed as possible factors respo nsible for the adhesion strengths. A fracture mechanism in thick films was suggested from analysis of adhesion strength and observation of m icrostructure. Adhesion strength was evaluated using the Weibull distr ibution function.