PROCESSING AND PERFORMANCE OF GOLD MCMS

The use of gold metallization in multichip modules (MCM's) has been in vestigated for the purpose of achieving simplified processing and high reliability. A process has been developed for producing multilayered, gold metallization thin film MCM (MCM-D) structures which reduces the number of processing steps compared to copper metallization. Multilay ered gold-polymer and gold-SiO2 test devices have been fabricated to e valuate the electrical and mechanical properties of the structures. Th e adhesion of a variety of dielectrics has been achieved by blanket co verage of the noble metal with a single step adhesion layer. The proce ssing, performance, adhesion layer, and cost of gold MCM-D structures on silicon substrates have been analyzed.