The growth limitations of strained multiple quantum wells are studied
theoretically. A dynamic strain relaxation model is developed to estim
ate both the critical layer thickness for barrier and well of multiple
quantum well InxGa1-xAs/GaAs device structures. According to the calc
ulations, if the well and barrier growth temperatures are 480 and 550-
degrees-C for a 30% indium 50 angstrom four-quantum-well structure, th
e minimum barrier thickness is around 150 angstrom, and for a 20% indi
um 40 angstrom thirty-quantum-well structure, the barrier layer thickn
ess could be as thin as 200 angstrom. This model should prove useful i
n optimizing practical strained-layer device structures.